-
BBT 2
-
BBT 3
-
BBT 4
-
2층_Deburring 1
-
Developing 1
-
Electro Copper Plating Line 1
-
Electro Copper Plating Line 2
-
Electro Copper Plating Line 3
-
2층_Electroless Copper Plating Line 1
-
Electroless Copper Plating Line 2
-
Etching-Stripping Line 1
-
2층_Etching-Stripping Line 2
-
Etching-Stripping Line 3
-
Laminator 1
-
UV Exposure 2
-
UV Exposure 3
| 층 | 장비명 | 수량 | 용도 | 제조사 |
|---|---|---|---|---|
| 2층 | Deburring M/C | 1 | 정면, 수세 | ISSII HYOKKI |
| Laminator | 2 | Dry Film 라미네이팅 | (주)세명벡트론 | |
| UV Exposure M/C | 3 | 패턴 노광 | (주)세명벡트론 | |
| Developing M/C | 1 | 패턴 현상 | Huge Dragon | |
| Copper Filter | 1 | 동분여과 | ISSII HYOKKI | |
| Electroless Copper Plating Line | 2 | 무전해 동도금 | PMC | |
| Etching-Stripping Line | 1 | 부식 & 박리 | Huge Dragon | |
| Etching-Controller | 1 | 부식액 자동공급 | Delta-AI | |
| Electro Copper Plating Line | 2 | 전해 동도금 | PAL | |
| Thickness Gauge | 1 | 도금 두께 측정 | ||
| BBT(Bare Board Tester) | 19 | Open, Short 검사 | MicroCraft 외 |